SASKATE Chip Tin Planting Set Fast Tin Planting, Strong Magnetic Adsorption, Stainless Steel BGA Reballing Stencil Set, with Magnetic Chip Positioning (for 8 Pieces)

Size:

for Huawei 8 Pieces

for IOS Phone 8 Pieces

for Qualcomm 7 Pieces

Detalles del producto

Disponibilidad
En stock

Peso con empaque
1.15 kg

Devolución
No

Condición
Nuevo

Producto de
Amazon

Viaja desde
USA

Sobre este producto

Specification: Item Type: Phone Tin Planting Set Tin Planting Mesh Material: Stainless Steel How to Use: 1. Put the CPU motherboard into the tin plating 2. Put the tin planting mesh on the CPU middle layer motherboard into the tinning table 3. The CPU tinning will automatically absorb the steel mesh 4. Take a small amount of solder paste and apply it to a clean cloth (slightly absorb the inside, which is more conducive to tin planting) 5. Fill the tin product and apply lightly 6. Evenly fill each hole with tin 7. After the solder paste is filled, wipe off the excess solder paste with a dust cloth. 8. Use tweezers to gently press both sides of the steel mesh, do not press on the hollow position in the middle 9. Do not remove the tinned wire mesh immediately after the air gun is heated. Wait until it cools before removing it. packing list: 1 x Planting Table 8 x Steel Mesh or8 x Steel Mesh or7 x Steel Mesh

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Accurate Positioning: Strong magnetic adsorption, fast tin planting, ball template will not change under high temperature, accurate positioning. Premium Materials: Made of stainless steel, it is strong, , not easy to damage, and has a long service life. Compact Portable: With fine workmanship, it has a compact appearance, it is portable and can be carried around. Easy To Operate: Adopts magnetic sliding cover opening and closing design, which is convenient to operate and use. Magnetic Automatic Clamping: Using a new type of magnetic power source positioning, magnetic automatic clamping, convenient and flexible, stable and clamping, support for a variety of CPU positioning.